Air Cavity QFNs

H-Pack

  • High Familiarity of Handling GaAs/GaN MMICs, and High Power DPC are Low Loss, High Thermal Conductive, Low CTE, Two-Layers Ceramic Substrate (AlN and 96% Al2O3)
  • DPC are Low Loss, High Thermal Conductive, Low CTE, Two-Layers Ceramic Substrate (AlN and 96% Al2O3)

  • Air-Cavity Package, Compose of DPC (Direct Plated Copper) Substrate and Economic Plastic / Ceramic Lid
  • Standard QFNs and Custom Designs Offered
  • Possible to Include Passive Elements on Substrate (50ohm Tline, Power Divider, Cap…etc)

  • Open-Tooled LCP / Ceramic Lids Available (4×4, 5×5, 6×6, 7×7, 8×8…)
  • Sintered Ag (>100W/mk) for Die Attach Compatible

  • Reasonable Leadtime and NRE Cost
  • RoHS and REACH Compliance Certificated
  • Proven to Work with RF Device up to 20GHz
  • Well Qualified Packages with Superior Bond Ability

Air Cavity
QFNs
H-Pack

  • DPC are Low Loss, High Thermal Conductive, Low CTE, Two-Layers Ceramic Substrate (AlN and 96% Al2O3)

  • Air-Cavity Package, Compose of DPC (Direct Plated Copper) Substrate and Economic Plastic / Ceramic Lid
  • Standard QFNs and Custom Designs Offered
  • Possible to Include Passive Elements on Substrate (50ohm Tline, Power Divider, Cap…etc)

  • Open-Tooled LCP / Ceramic Lids Available (4×4, 5×5, 6×6, 7×7, 8×8…)
  • Sintered Ag (>100W/mk) for Die Attach Compatible

  • Reasonable Leadtime and NRE Cost
  • RoHS and REACH Compliance Certificated
  • Proven to Work with RF Device up to 20GHz
  • Well Qualified Packages with Superior Bond Ability

PACKAGING SERVICE