Air-Cavity-QFNs -

Air Cavity QFNs

Air Cavity Premold LF

High Familiarity of Handling GaAs/GaN MMICs, and High Power Materials such as Sintered Ag, High Thermal Conductivity Substrates

Open-Tooled Air-Cavity QFNs, Common Body Size and Lead Counts Available
Custom Design on Air-Cavity QFN Provided
Proper Solution for Both Rapid Prototyping and High Volume Production
Reasonable Leadtime and NRE Cost

RoHS and REACH Compliance Certificated
Proven to Work with RF Device up to 20GHz
Well Qualified Packages with Superior Bond Ability

Air Cavity
QFNs

- High Familiarity of Handling GaAs/GaN MMICs, and High Power Materials such as Sintered Ag, High Thermal Conductivity Substrates
- Open-Tooled Air-Cavity QFNs, Common Body Size and Lead Counts Available
- Custom Design on Air-Cavity QFN Provided
- Proper Solution for Both Rapid Prototyping and High Volume Production
- Reasonable Leadtime and NRE Cost

Air Cavity
Premold LF

RoHS and REACH Compliance Certificated
Proven to Work with RF Device up to 20GHz
Well Qualified Packages with Superior Bond Ability

Open-tooled QFNs

Open-tooled QFNs

Open-tooled QFNs

PACKAGING SERVICE

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Packaging

Overmold
QFNs

Air Cavity
QFNs

Air Cavity
QFNs H-Pack

TSSOP

package

High Power MetaI Package

Flip Chip Packaging