Author: ginpintec

Semicon Taiwan 2025: 
Thank You for Another Year of Innovation and Collaboration

 2025/09/14 

As SEMICON Taiwan 2025 comes to a close, the Ginpintec team is still filled with excitement and appreciation. This year’s exhibition once again brought together global leaders from the semiconductor ecosystem, and we are grateful to have been part of this inspiring gathering. 

At this year’s SEMICON, we showcased our latest advancements in advanced packaging measurement, wafer-level reliability testing, and high-precision system integration. Many visitors were especially interested in how Ginpintec combines RF measurement know-how with packaging engineering expertise to support emerging applications in HPC, 5G/6G, AI accelerators, and heterogeneous integration

From technical discussions to project planning with partners, every conversation reminded us of the importance of innovation, precision, and collaboration. Your feedback and expectations motivate us to continually refine our solutions and push the boundaries of advanced measurement technologies.

We sincerely thank everyone who visited our booth at SEMICON Taiwan 2025. Your trust and encouragement fuel our commitment to enabling smarter, faster, and more reliable semiconductor technologies for the next generation.

We look forward to seeing you again next year and to working together to shape the future of advanced packaging and precision measurement.

TADTE Taiwan 2025: 
Sincere Thanks to All for joining Us On This Incredible Journey

 2025/09/27

Time flies, and it’s hard to believe that a week has 

already passed since TADTE Taiwan 2025 came to and exciting close! Our team at Ginpintec is still energized, looking back at the inspiring converstations,cutting-edge innovations, and unforgettable moments shared thourghtthe event.

This year’s TADTE brought together global leaders across defense, aerospace, and advanced technology  and we are proud to have showcased our capabilities in advanced packaging measurement, RF & mmWave testing, and precision system integration. From demonstrating our expertise in high-accuracy packaging characterization to sharing insights on next-generation reliability testing, every exchange reinforced our mission: to push the boundaries of precision testing.

Reflecting on the exhibition, we feel a deep sense of accomplishment. Not only did we witness remarkable breakthroughs, but we also built valuable connections with partners, customers, and innovators

We sincerely thank everyone who visited Ginpintec at TADTE Taiwan 2025. Your support, feedback, and enthusiasm continue to motivate us as we work together to drive innovation in advanced packaging measurement, mission-critical test environments, and next-generation semiconductor technologies.

We look forward to seeing you again and to shaping the future of precision testing, hand in hand.