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About Ginpintec
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On Wafer Testing
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Final Testing
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FLIP Chip PACKAGE
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Flip Chip PKG
(Top Cooling)
Flip Chip PKG
(w/i Air Cavity)
Flip Chip
Packaging
Flip Chip PKG
(Top Cooling)
Flip Chip PKG
(w/i Air Cavity)
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PACKAGING SERVICE
Overmold QFNs
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Air Cavity QFNs-Hpack
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Overmold
QFNs
Air Cavity
QFNs
Air Cavity
QFNs H-Pack
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