FLIP-Chip-PACKAGE -

FLIP Chip PACKAGE

mmWave Top-Side Cooling Package

Flip chip package with heatsink on top side
RF signals go from bottom side with RDL-like carrier for low loss consideration
C4 / GGI supported
Offering operating frequency up to 60GHz
Properly managing thermal and electrical paths separately to optimize product performance
Suitable for mmWave applications

Flip Chip
Packaging

Flip Chip Package
(Top Cooling)

Flip chip package with heatsink on top side

RF signals go from bottom side with RDL-like carrier for low loss consideration

C4 / GGI supported

Offering operating frequency up to 60GHz

Properly managing thermal and electrical paths separately to optimize product performance

Suitable for mmWave applications

More

Packaging

Overmold
QFNs

Air Cavity
QFNs

Air Cavity
QFNs H-Pack

TSSOP

package

High Power MetaI Package

Flip Chip Packaging

PACKAGING SERVICE