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About Ginpintec
Product & Service
Technical Support
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About Ginpintec
Product & Service
Technical Support
Contact Us
About Ginpintec
Product & Service
On Wafer Testing
Packaging
Final Testing
Others
Technical Support
On Wafer Testing
Packaging
Final Testing
Contact Us
Menu
About Ginpintec
Product & Service
On Wafer Testing
Packaging
Final Testing
Others
Technical Support
On Wafer Testing
Packaging
Final Testing
Contact Us
High Power
Metal
Package
Nearly hermetic epoxy-sealed package
DPC AlN / Al2O3 ceramic adopted as substrate
Offering excellent thermal and electrical characteristics
Designed for med. to high power (up to 60W) and high-frequency (up to 20GHz) GaAs/GaN MMICs
Inquiry
High Power Metal Package
Fully hermetic seam-welded package
Package with CuMo metal base for die attach,with ceramic insulator for RF input/output
Air-cavity structure, sintered Ag, and ball/wedge bond compatible
Supporting ultra high-power (up to 400W) handling & deliveringlow-loss RF characteristics
Outstanding reliability performance
Inquiry
More
Packaging
Overmold
QFNs
Air Cavity
QFNs
Air Cavity
QFNs H-Pack
TSSOP
package
High Power MetaI Package
Flip Chip Packaging
PACKAGING SERVICE
Overmold QFNs
Air Cavity QFNs
Air Cavity H-pack
TSSOP Package
High Power Metal Package
Flip Chip Package(Top Cooling)
Successful Project
