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About Ginpintec
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About Ginpintec
Product & Service
Technical Support
Contact Us
About Ginpintec
Product & Service
On Wafer Testing
Packaging
Final Testing
Others
Technical Support
On Wafer Testing
Packaging
Final Testing
Contact Us
Menu
About Ginpintec
Product & Service
On Wafer Testing
Packaging
Final Testing
Others
Technical Support
On Wafer Testing
Packaging
Final Testing
Contact Us
High Power
Metal
Package
Metal package, compose of Heat sink (Cu-Mo-Cu) substrate and economic metal lid.
Metal Package is a high thermal conductive, low CTE, two-kind of metal material (Cu and Mo)
Sintered Ag (>100W/mk) for die attach compatible
Inquiry
High Power Metal PKG
Metal package, compose of Heat sink (Cu-Mo-Cu) substrate and economic metal lid.
Metal Package is a high thermal conductive, low CTE, two-kind of metal material (Cu and Mo)
Sintered Ag (>100W/mk) for die attach compatible
Inquiry
PACKAGING SERVICE
Overmold QFNs
Air Cavity QFNs
Air Cavity QFNs-Hpack
TSSOP Package
High Power Metal PKG
Flip Chip PKG (w/i Air Cavity)
Sucess Project
More
Packaging
Overmold
QFNs
Air Cavity
QFNs
Air Cavity
QFNs H-Pack
TSSOP
package
High Power MetaI Package
Flip Chip Packaging
