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About Ginpintec
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Technical Support
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About Ginpintec
Product & Service
Technical Support
Contact Us
About Ginpintec
Product & Service
On Wafer Testing
Packaging
Final Testing
Others
Technical Support
On Wafer Testing
Packaging
Final Testing
Contact Us
Menu
About Ginpintec
Product & Service
On Wafer Testing
Packaging
Final Testing
Others
Technical Support
On Wafer Testing
Packaging
Final Testing
Contact Us
Overmold QFNs
Overmold QFN
Routable QFN
Overmold LGA
Open-Tooled QFNs
(Pre-Molded Lead Frame) are Available from
Pre-Molded QFNs with Glob Top can be Used for Quick Prototyping and Characterization.
Overmold QFNs are Mature and in High-Volume Production.
Cost-effective packaging solution
High variety of open-tooled packages (3×3 to 9×9) available
Provide reliable thermal & electrical performance
Ideal for high-volume manufacturing
Inquiry
Overmold
QFNs
Open-Tooled QFNs
(Pre-Molded Lead Frame) are Available from
Pre-Molded QFNs with Glob Top can be Used for Quick Prototyping and Characterization.
Overmold QFNs are Mature and in High-Volume Production.
Cost-effective packaging solution
High variety of open-tooled packages (3×3 to 9×9) available
Provide reliable thermal & electrical performance
Ideal for high-volume manufacturing
Overmold QFN
Routable QFN
Overmold LGA
Open-tooled QFNs
Open-tooled QFNs
Inquiry
Open-tooled QFNs
Inquiry
More
Packaging
Overmold
QFNs
Air Cavity
QFNs
Air Cavity
QFNs H-Pack
TSSOP
package
High Power MetaI Package
Flip Chip Packaging
PACKAGING SERVICE
Overmold QFNs
Air Cavity QFNs
Air Cavity H-pack
TSSOP Package
High Power Metal Package
Flip Chip Package(Top Cooling)
Successful Project
