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About Ginpintec
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About Ginpintec
Product & Service
Technical Support
Contact Us
About Ginpintec
Product & Service
On Wafer Testing
Packaging
Final Testing
Others
Technical Support
On Wafer Testing
Packaging
Final Testing
Contact Us
Menu
About Ginpintec
Product & Service
On Wafer Testing
Packaging
Final Testing
Others
Technical Support
On Wafer Testing
Packaging
Final Testing
Contact Us
TSSOP
package
20L E-TSSOP / 0.65 mm Pitch
0.1 nm GaN Die
⌀2 mil Au Wire
20L TSSOP Matted
Sn Plating
Wire Length will be strictly monitored
in order to meet recommended length
values. Profile to be adjusted during
the sample build
TSSOP
package
0.1 nm GaN Die
⌀2 mil Au Wire
20L TSSOP
Matted Sn Plating
Wire Length will be strictly monitored
in order to meet recommended length
values. Profile to be adjusted during
the sample build
Inquiry
PACKAGING SERVICE
Overmold QFNs
Air Cavity QFNs
Air Cavity QFNs-Hpack
TSSOP Package
High Power Metal PKG
Flip Chip PKG (w/i Air Cavity)
Sucess Project
Inquiry
More
Packaging
Overmold
QFNs
Air Cavity
QFNs
Air Cavity
QFNs H-Pack
TSSOP
package
High Power MetaI Package
Flip Chip Packaging
