Package Production Line are Located in the Class 10000 Clean Room
Including epoxy dispensing, stamping, die attach, Flip chip, C2/C4 and Eutectic process to meet different technical services requirement. The equipment accuracy is 3um@3 sigma, with the minimum chip size to 0.15mm.
The oven is an oxygen-free oven, capable of reaching temperatures up to 300°C, and is equipped with 6-point temperature monitoring for process control.
Package Production Line are Located in the Class 10000 Clean Room
Including epoxy dispensing, stamping, die attach, Flip chip, C2/C4 and Eutectic process to meet different technical services requirement. The equipment accuracy is 3um@3 sigma, with the minimum chip size to 0.15mm.
The oven is an oxygen-free oven, capable of reaching temperatures up to 300°C, and is equipped with 6-point temperature monitoring for process control.