Technical Support

On Wafer Testing

RF / DC PROBE HEAD AND RF ACCESSORIES

  • MEMS Type Probe Head with Better Performance up to 110GHz in Standard Configuration : GS, SG, GSG, GSSG, GSGSG
  • Special Configuration Request could be Design with Cantilever Type (Max Frequency ~ 67GHz)
  • Pure DC or DC / RF Wedge Probe Head were also Provided
  • The Cal Kit is Standard Pitch GSG 100um, 150um, 200um & 250um with OSLT Calibration
  • We Provide the High Quality GORE / WAKA RF Accessories with Max Frequency 110GHz and WR-10 Connector

RF / DC PROBE HEAD AND RF ACCESSORIES

  • MEMS Type Probe Head with Better Performance up to 110GHz in Standard Configuration : GS, SG, GSG, GSSG, GSGSG
  • Special Configuration Request could be Design with Cantilever Type (Max Frequency ~ 67GHz)
  • Pure DC or DC / RF Wedge Probe Head were also Provided
  • The Cal Kit is Standard Pitch GSG 100um, 150um, 200um & 250um with OSLT Calibration
  • We Provide the High Quality GORE / WAKA RF Accessories with Max Frequency 110GHz and WR-10 Connector

6 INCH TEST SYSTEM IN CLEAN ROOM

  • All Test System are Located in the Class 5000 Clean Room
  • All DUT Wafers are Storage in the RH < 20% Dry Cabinet
  • Auto Probe Station Support 6 inch Wafer Level Test (4 inch also Compatible)
  • RF On-Wafer (RFOW) Compatible with Well Known RF Equipment Manufactures Anritsu / R & S

6 INCH TEST SYSTEM
IN CLEAN ROOM

  • All Test System are Located in the Class 5000 Clean Room
  • All DUT Wafers are Storage in the RH < 20% Dry Cabinet
  • Auto Probe Station Support 6 inch Wafer Level Test (4 inch also Compatible)
  • RF On-Wafer (RFOW) Compatible with Well Known RF Equipment Manufactures Anritsu / R & S

OUTPUT DATA FORMAT

  • GINPINTEC Provide the csv Data Format
  • The Die Location Provide 2 Dimensional XY Coordinate

OUTPUT DATA FORMAT

  • GINPINTEC Provide the csv Data Format
  • The Die Location Provide 2 Dimensional XY Coordinate

PROCESS CONTROL

The push-pull force testing machine is used for process production monitoring, ensuring the stability of the production process.

 

  • Die bonding process
  • Die shear test

Technical Support

Packaging

Process Control

The push-pull force testing machine is used for process production monitoring, ensuring the stability of the production process.

  • (Die bonding process)
  • (Die shear test)
  • Wire bonding process
  • Wire pull test
  • (Wire bonding process)
  • (Wire pull test)
  • Ball shear test
  • Ball shear test

PACKAGE IN CLEAN ROOM

Package Production Line are Located in the Class 10000 Clean Room

Including epoxy dispensing, stamping, die attach, Flip chip, C2/C4 and Eutectic process to meet different technical services requirement. The equipment accuracy is 3um@3 sigma, with the minimum chip size to 0.15mm.

 

The oven is an oxygen-free oven, capable of reaching temperatures up to 300°C, and is equipped with 6-point temperature monitoring for process control.

PACKAGE IN CLEAN ROOM

Package Production Line are Located in the Class 10000 Clean Room

Including epoxy dispensing, stamping, die attach, Flip chip, C2/C4 and Eutectic process to meet different technical services requirement. The equipment accuracy is 3um@3 sigma, with the minimum chip size to 0.15mm.

The oven is an oxygen-free oven, capable of reaching temperatures up to 300°C, and is equipped with 6-point temperature monitoring for process control.

SYSTEM TOPOLOGY

Rack & Stack System Provide Modification
to Meet Customer Requirement

Technical Support

Final Testing

SYSTEM TOPOLOGY

Rack & Stack System Provide Modification to Meet Customer Requirement

TRAY Type

Support JEDEC/EIAJ Tray or Customize Tray

TRAY Type

Support JEDEC/EIAJ Tray or Customize Tray

OUTPUT DATA FORMAT

  • FT Test Raw Data Format could be CSV and excel
  • Column Bin Define the Good and Bad Die

OUTPUT DATA FORMAT

  • FT Test Raw Data Format could be Csv and Excel
  • Column Bin Define the Good and Bad Die