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About Ginpintec
Product & Service
Technical Support
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About Ginpintec
Product & Service
On Wafer Testing
Packaging
Final Testing
Others
Technical Support
On Wafer Testing
Packaging
Final Testing
Contact Us
Menu
About Ginpintec
Product & Service
On Wafer Testing
Packaging
Final Testing
Others
Technical Support
On Wafer Testing
Packaging
Final Testing
Contact Us
On Wafer Testing Service
Packaging Service
Final Testing Service
Other
ON WAFER RF TESTING SERVICE
R&S ZNA43 40GHz 4 Port
Anritsu MS4647 E-Band VNA
Semi-Auto System
Rack & Stack
Product & Service
On Wafer Testing
ON WAFER RF TESTING SERVICE
R&S ZNA43 40GHz 4 Port
Anritsu MS4647 E-Band VNA
Semi-Auto System
Rack & Stack
Inquiry
VARIABLE TESTING MAP
VARIABLE TESTING MAP
Inquiry
HIGH POWER PA ON WAFER RF + DC TESTING SERVICE
40GHz 40W PA MMIC
Pulse Width ~ 5us DC / 3us RF (3% Duty Cycle)
Oscilloscope Perform Kelvin Test in Drain Voltage Drop
DC Waveform Voltage and Current @5us Pulse Width
Inquiry
HIGH POWER PA ON WAFER
RF + DC TESTING SERVICE
DC waveform@5us pulse
RF 3us on within 5us DC
40GHz 40W PA MMIC
Pulse Width ~ 5us DC / 3us RF (3% Duty Cycle)
Oscilloscope Perform Kelvin Test in Drain Voltage Drop
DC Waveform Voltage and Current @5us Pulse Width
Inquiry
FINAL TESTING SERVICE
Solder EVB
Johnstech Socket
Customized (Rack & Stack) RF System
Drain Sense for HPA
10GHz Test Tation
Product & Service
FINAL TESTING SERVICE
Solder EVB
Johnstech Socket
Customized (Rack & Stack) RF System
10GHz Test Tation
Drain Sense for HPA
CAPABILITY
CAPABILITY
SUCCESSFUL CASE
Packaging and Final Testing (5.5GHz, Core Chip)
5.5GHz, GaN, Core Chip, HPA (47dBm) / LNA in Single QFN
Overall FT Yield > 95%
Inquiry
SUCCESSFUL CASE
Packaging and Final Testing (5.5GHz, Core Chip)
5.5GHz, GaN, Core Chip, HPA (47dBm) / LNA in Single QFN
Overall FT Yield > 95%
Inquiry
OTHERS
High Power PA Test Fixture Design
Transceiver IC Testing Service
Customized RF Cable Design & Manufacture
Inquiry
OTHERS
High Power PA Test Fixture Design
Transceiver IC Testing Service
Customized RF Cable Design & Manufacture
Inquiry
PACKAGING SERVICE
Overmold QFNs
Air Cavity QFNs
Air Cavity QFNs-Hpack
TSSOP Package
High Power Metal PKG
Flip Chip PKG (w/i Air Cavity)
Sucess Project
Product & Service
Packaging
Air Cavity
QFNs
Air Cavity
QFNs H-Pack
TSSOP
package
High Power MetaI Package
Flip Chip Packaging
Overmold
QFNs